Leadframe Design Enhancement for Elimination of Burrs at Singulation Process

The paper focused on the improvement done in leadframe design to address the copper (Cu) burrs defect in assembly manufacturing. Newly qualified device struggled to hit the target yield due to the said Cu burrs defect. A holistic approach through why-why analysis was performed by the technical cross-functional team to identify the root-cause and come-up with the robust solution to the issue. The paper discussed how the device in focus was made as point of reference in designing a leadframe carrier. Ultimately, the new and enhanced leadframe design successfully eliminated the occurrence of Cu burrs with 100% improvement in the scrappage rate.